ASME Interpack 2019

Date: 10/07/2019-10/09/2019

Join us at the ASME Interpack 2019 on October 7th-9th, 2019 in Anaheim, California. Gil Sharon, Senior Application Engineer at ANSYS-DfR Solutions, will be presenting "Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs" on Wednesday, Oct. 9th at 10:45 am as part of the technical track 8-1: ECU Level Reliability. 

Topic: printed circuit boards, Electronics Reliability, microvias, printed circuit board, plated through holes, finite element analysis

Read More