How to Use Thermal-Mechanical Analysis to Identify System-Level Effects on Solder Fatigue: Mirroring, Underfill, and Overconstrained Boards

Thursday, September 28 at 11:00 am

Presented by Craig Hillman and Natalie Hernandez

Thermal issues are at the root of many failures in today’s electronics designs. Modern products are more complex and smaller than ever before - and require even more power.  The more complex the design, the greater the thermal strain on the components. To help reduce this risk and ensure more reliable products, electronics manufacturers conduct thermal-mechanical analyses on their devices. However, this can be time consuming and costly. 
In this webinar you will learn how to use a Physics of Failure approach to quickly and easily mitigate the system level effects on solder joint reliability during temperature cycling. 

Use the form to register for the How to Use Thermal-Mechanical Analysis to Identify System-Level Effects on Solder Fatigue webinar on Thursday,  September 28 at 11 am EDT.