DfR Solutions Reliability Designed and Delivered

How Scanning Acoustic Microscopy Aids in Electronics Failure Analysis

Posted by James McLeish on Apr 25, 2017 11:20:00 AM

Decapsulation and cross-sectioning are two failure analysis techniques frequently used to root cause failure issues in electronics.  However, these destructive methods that are expensive and time consuming,  can be made more effective by the use of Scanning Acoustic Microscopy (SAM)  to identify the most likely failure site for destructive methods to be focused on. 

Topics: Failure Analysis

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The Value of Digital Image Correlation in Electronic Design and Root Cause Analysis

Posted by Josh Akman on Apr 18, 2017 9:37:00 AM

Companies routinely ask us how they can be sure that their product will meet reliability targets. We explain that it is always more effective to proactively design reliability into the product than to retroactively test for it. Virtual qualification using simulation is a great way to assess whether your design will meet reliability targets under specific environments.

Topics: Test Plan Development

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4 Steps to Demonstrating Product Lifetime and Achieving Long-Term Product Reliability

Posted by Craig Hillman on Apr 13, 2017 9:23:00 AM

As a new engineer, you have just been assigned as the lead designer on a revolutionary product for your company. It’s an exciting, career-defining opportunity for advancement. One problem: The customer wants the product to last 20 years. How are you going to meet this requirement? Use DfR Solutions' exclusive four step process to rise to the challenge:

Topics: Test Plan Development

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4 Reliability Factors to Address With Avionics Systems Lifecycle Simulation

Posted by Ed Dodd on Apr 11, 2017 8:42:00 AM

Avionics systems are complex and often interdependent, as demonstrated in an aircraft cockpit that houses control, monitoring, communication, navigation, weather and anti-collision systems. These highly regulated electronics are among the most expensive and standardized products available—considerable investments that are expected to perform for up to 30 years, making the determination of product lifetime reliability a top priority.

Topics: Sherlock, Avionics

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5 Alternatives to MTBF

Posted by James McLeish on Apr 6, 2017 9:24:00 AM

In a previous blog post we explored how Mean Time Between Failure (MTBF), despite being commonly used, is not an effective metric for measuring and accessing the reliability of existing equipment or systems, or for predicting the reliability of future equipment or systems being developed. 

MTBF isn’t the sole option. Here are five alternative approaches to failure prediction:

Topics: Test Plan Development

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Key Takeaways from the 2017 Design for Reliability Conference

Posted by Craig Hillman on Apr 4, 2017 9:24:00 AM
What You May Have Missed

It’s been a couple weeks since our annual Design for Reliability Conference took place at the Sheraton Inner Harbor Hotel in historic Baltimore, but I’m still reflecting on the captivating speakers and their insights, in addition to the invaluable networking that took place. With over 100 attendees, there were many fascinating conversations to be had, and I’m looking forward to advancing those relationships, both old and new.

Topics: Design for Reliability, Physics of Failure

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Reliability in Avionics: Using Virtual Prototyping, Simulation and PoF

Posted by Lloyd Condra on Mar 28, 2017 8:56:48 AM

Modern electronics have continued in the pattern of Moore’s Law which has decreased transistor size and increased performance. This necessitates development of faster, smaller ICs with greatly reduced power dissipation. However, the increased number of transistors in smaller spaces causes higher power density which can lead to higher failure rates, shorter device lifetimes and unanticipated early device wearout.

Topics: Physics of Failure, Avionics

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How to Evaluate Integrated Circuit (IC) Components for High Reliability Applications

Posted by Ashok Alagappan on Mar 23, 2017 9:24:00 AM

Most of the microcircuits used in Aerospace, Defense and High Performance (ADHP) applications today are commercial-off-the-shelf (COTS) components targeted for markets other than ADHP, with required lifetimes that are typically significantly shorter than those of ADHP applications. COTS component manufacturers evaluate their components’ expected lifetimes in the target applications, but provide little or no information for ADHP applications. Thus, it is the responsibility of the ADHP user to conduct the appropriate analyses and, where necessary, mitigate for shorter-than-required lifetimes.

Topics: Physics of Failure

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How Physics of Failure Helps Bring Reliable Avionics Products to Market Faster

Posted by Ed Dodd on Mar 21, 2017 10:58:39 AM

Global avionics is enjoying a period of rapid growth that, when coupled with the relatively low cost of entry into the industry, makes it a very attractive option for new players. This increasingly crowded and competitive landscape makes it even more important to be first to market with new technologies, which can leave less time for reliability testing.

Topics: Physics of Failure

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Reliability Update at DfR Solutions

Posted by Chris Montgomery on Mar 16, 2017 9:20:00 AM

Over the past year at DfR Solutions, we’ve continued our commitment to providing advanced solutions and expertise to our customers. From our enhanced in-house testing capabilities to adding new team members who bring unprecedented skills to our team, we are focused on providing the best insights in electronics reliability and quality.

Topics: Design for Reliability

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