DfR Solutions Reliability Designed and Delivered

How to Evaluate Integrated Circuit (IC) Components for High Reliability Applications

Posted by Ashok Alagappan on Mar 23, 2017 9:24:00 AM

Most of the microcircuits used in Aerospace, Defense and High Performance (ADHP) applications today are commercial-off-the-shelf (COTS) components targeted for markets other than ADHP, with required lifetimes that are typically significantly shorter than those of ADHP applications. COTS component manufacturers evaluate their components’ expected lifetimes in the target applications, but provide little or no information for ADHP applications. Thus, it is the responsibility of the ADHP user to conduct the appropriate analyses and, where necessary, mitigate for shorter-than-required lifetimes.

Topics: Physics of Failure

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How Physics of Failure Helps Bring Reliable Avionics Products to Market Faster

Posted by Ed Dodd on Mar 21, 2017 10:58:39 AM

Global avionics is enjoying a period of rapid growth that, when coupled with the relatively low cost of entry into the industry, makes it a very attractive option for new players. This increasingly crowded and competitive landscape makes it even more important to be first to market with new technologies, which can leave less time for reliability testing.

Topics: Physics of Failure

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Reliability Update at DfR Solutions

Posted by Chris Montgomery on Mar 16, 2017 9:20:00 AM

Over the past year at DfR Solutions, we’ve continued our commitment to providing advanced solutions and expertise to our customers. From our enhanced in-house testing capabilities to adding new team members who bring unprecedented skills to our team, we are focused on providing the best insights in electronics reliability and quality.

Topics: Design for Reliability

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What is Physics of Failure?

Posted by Dr. Randy Schueller on Mar 14, 2017 9:23:00 AM

Product performance and reliability are non-negotiables in defense applications. It’s a statement as true now as it was during World War II, when the U.S. military experienced significant malfunctions in aircraft electronics. Then, reliability engineering was just being introduced and focused on metal fatigue and fracture, and solutions were often time-consuming, expensive and ultimately ineffective. These initial efforts, however, spurred a  shift to electronics reliability prediction simulation and testing that served as the basis for the Physics of Failure (PoF) approach that is common in many industries today.

Topics: Physics of Failure

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Top 5 Reasons Not to Miss the Design for Reliability Conference

Posted by Chris Montgomery on Mar 9, 2017 7:33:00 AM

By now, you’ve heard about our stellar lineup of speakers presenting at the upcoming 2017 Design for Reliability Conference on March 20 in Baltimore, Maryland. Global experts will present on topics ranging from solder joint reliability and battery technologies to the challenges facing autonomous vehicles and aerospace systems. Conference attendees will experience a day full of practical and applicable information they can take back to their teams to implement.

Topics: Design for Reliability

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Integrating Physics of Failure (PoF) into Complex Systems

Posted by Ed Dodd on Mar 7, 2017 7:41:00 AM

Ensuring that a product will perform and function as promised is the key to any manufacturer’s success in the marketplace. As systems become more complex and intricately designed, and as manufacturers rush to be first-to-market, the challenge of performing accurate and timely reliability testing increases, as was demonstrated in recent newsworthy technology failures.

Topics: Physics of Failure

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How to Ensure Electronic Product Reliability When You Don’t Have Time to Test

Posted by Craig Hillman on Mar 2, 2017 9:42:00 AM

With today’s rapid product development cycles and time-to-market pressures, there’s not always time to perform reliability testing. This situation leaves many manufacturers with the question of how to ensure their products will be dependable when reliability testing and the possible resulting re-engineering are too time consuming or expensive.

Topics: Design for Reliability, Test Plan Development

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Solder Joint Reliability — Exposing the Weakest Link

Posted by Craig Hillman on Feb 28, 2017 7:37:00 AM

Electronic systems may often fail, not because of poorly designed chips, substrates or other components, but because of the failure of the solder joints that link them all together. The mismatch between PCB solder materials can result in thermal expansion problems including excessive strain, cracking and open circuits. The impact of thermal fatigue, soldering defects, vibration and residual strains must be considered when analyzing solder reliability. These and other issues are often exposed in accelerated stress tests.

Topics: Design for Reliability

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Does Anyone Care About Tin Whiskers Anymore?

Posted by Craig Hillman on Feb 23, 2017 9:23:00 AM

Anyone remember tin whiskers? The destroyers of all that is good and just with electronic hardware?

Topics: Design for Reliability

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Understanding the Root Causes of Battery Failure

Posted by Vidyu Challa on Feb 21, 2017 9:35:00 AM

The race to improve the performance and reliability of batteries is on, from electric vehicles to advances in wearables and mobile devices. In the pursuit of performance and the desire to outpace competitors, manufacturers may be tempted to overlook potential shortfalls. Most notably, Samsung made news when the company halted production of its Galaxy Note 7 and eventually scrapped the entire product after devices caught fire.

Topics: Battery Reliability

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