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DfR Solutions is committed to providing the most up-to-date information to maximize and accelerate your product integrity and assurance activities. Below you will find a listing of our most current white papers in PDF format. If you would like additional information on these or any other reliability topics, please feel free to call us at 301-474-0607, or send us an email.

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• Ensuring and Predicting the Reliability of Concentrated Photovoltaic (CPV): Interconnect Structures
• Capturing the Robustness of Glass Panels in Touch-Screen Displays
• Factors that Drive LED Reliability
• Understanding the Risk of Gold Flash
• Quality and Reliability Challenges for Package-on-Package
• Uprating of Magnetic Components
• Introduction to Japanese Style Mizenboushi Methods
• The Next Reliability Challenge: Free Air Cooling 
• Uprating of Plastic Axial Fans
• Opto-Electronics: The Secret to Success
• Solder Phase Coarsening, Fundamentals, Preparation, Measurement, and Prediction
• Circuit Analysis Sucess Stories
• SnBi and SnPb
• 0.3mm Pitch Chip Scale Packages: Changes and Challenges
• Processing and Reliability Issues for Eutectic AuSn Solder Joints
• The Reliability Cycle: Understanding the Booms and Busts of Reliability in Electronics  
• The Complexities of a Lead-Free Transition 
• Reliability Issues for Optical Transceivers
• Conductive Anodic Filaments: The Role of Epoxy-Glass Adhesion
• Design and Process Guidelines for QFNs: Manufacturability and Compatibility
• An Update on RoHS2
• A Change in Paradigm: Maximum Tin Whisker Lengths Just Got Longer
• Hollow Fiber Measurement Technique
• Bromide Free
• Common Reliability Problems in Opto-Electronic Packaging: Epoxies
• Derating of Schottky Diodes
• Failure Mechanisms in High Voltage PCBs
• Five Myths of Reliability
• Hollow Fiber Measurement Technique
• Know Your Environment
• LED Failures
• Moisture in Hermetic Packages
• NEBS Requirements for Pb-free
• Qualifying for Moisture Containing Environments
• Rapid Strength Assessment Technique for AMLCDs
• Red Phosphorus-Induced Failures in Encapsulated Circuits
• Review of Models for Time-to-Failure Due to Metallic Migration Mechanisms
• RoHS Exemptions
• Temperature Dependence of Electrical Overstress
• The Tin Myth
• Top 5 EMC Do’s & Don’ts
• Uprating of Ceramic Capacitors
• Uprating of Crystal Oscillators
• Uprating of Electrolytic Capacitors
• Vehicle Prognostics to Enable Optimized Maintenance and Logistics
• Why HALT Is Not HALT