Solder joint reliability is often a pain point in the design of an electronic system. A wide variety of factors affect solder joint reliability, and any one of them can drastically affect joint lifetime in a negative way. Properly identifying and mitigating potential causes of solder joint failure during the design and manufacturing process can prevent costly and difficult to solve problems later in a product lifecycle. Some of the most commonly observed solder joint failure contributors to consider are described here.
Failure analysis is the process of identifying, and typically attempting to mitigate, the root cause of a failure. In the electronics industry, failure analysis typically involves isolating the failure to a location on a printed circuit board assembly (PCBA) before collecting more detailed data to investigate which component or board location is functioning improperly.