Chris Montgomery

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DfR Solutions to Receive Honorable Mention at 2017 IPC APEX EXPO

Posted by Chris Montgomery on Feb 7, 2017 11:46:32 AM

Technical paper provides new insight into low cycle fatigue life of solder joints in electronic packages with encapsulations

Beltsville, MD – February 7, 2017 – DfR Solutions, a leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that its technical paper, "Effect of Encapsulation Materials on Tensile Stress during Thermo-Mechanical Cycling of Pb-Free Solder Joints," will receive an Honorable Mention at the 2017 IPC APEX EXPO. Authored by DfR Solutions’ reliability experts Dr. Craig Hillman, Maxim Serebreni, Dr. Nathan Blattau, and Dr. Gilad Sharon, the paper explores the effect of polymer encapsulations on solder joints as it relates to reliability.

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