DfR Solutions Reliability Designed and Delivered

Greg Caswell Receives Lifetime Achievement Award Presented by International Microelectronics Assembly and Packaging Society

Posted by DfR Solutions on Oct 3, 2018 10:41:42 PM

Beltsville, MD – October 2, 2018 – DfR Solutions, pioneer in Reliability Physics and leader in quality, reliability, and durability solutions for the electronics industry, today announced that Greg Caswell, Senior Member of the Technical Staff at DfR Solutions, has been awarded the 2018 Lifetime Achievement Award by the International Microelectronics Assembly and Packaging Society (IMAPS).

The Lifetime Achievement Award is given to a member of the Society who, in the opinion of the Lifetime Achievement Awards Selection Committee, has made exceptional, visible, and sustained impact on the microelectronics packaging industry in technology, business or both. Because this award recognizes long term and exceptional impact on the greater microelectronics industry, recipients of this award automatically become Life Members and Fellows of the Society. 

Mr. Caswell has been a highly-regarded thought leader in the electronics contract manufacturing and component packaging industries for the past 45 years. Caswell is an industry expert in SMT, advanced packaging, printed board fabrication, circuit card assembly and bonding solutions using nanotechnology. He led application development for the RNT Nanofoil® and ensured a successful transition of product technology to Indium Corporation. Caswell continues to be the leading authority in NanoBonding® implementation for component mounting applications.  During his 10-year tenure at DfR Solutions, he has worked on more than 300 client projects ranging from design reviews and failure analyses to on-site supplier audits across the globe. He continues to write highly sought-after technical papers, journal articles, and blogs and he is a popular webinar presenter. Mr. Caswell has presented over 250 papers at conferences all over the world and has taught courses at IMAPS, SMTA and IPC events. He helped design the first pick and place system used exclusively for SMT in 1978, edited and co-authored the first book on SMT in 1984 for ISHM, and built the first SMT electronics launched into space. Mr. Caswell has a B.S. in electrical Engineering from Rutgers University in New Brunswick, New Jersey and a B.A. in Management from St. Edwards University in Austin, Texas.

Topics: DfR Solutions

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Announcing Sherlock Automated Design Analysis™ for SOLIDWORKS® 3D CAD

Posted by DfR Solutions on Sep 26, 2018 1:37:55 PM

THE ONLY CAD TO CAE SOLUTION DELIVERING RELIABILITY PHYSICS PREDICTIONS

Beltsville, MD – September 26, 2018 – DfR Solutions, pioneer in Reliability Physics Analysis and leader in quality, reliability, and durability solutions for the electronics industry, today announced a major new release of its Sherlock Automated Design Analysis™ software, version 6.0, Sherlock for SOLIDWORKS 3D CAD Integration.  This significant new release includes integration with SOLIDWORKS 2018 that now empowers all SOLIDWORKS users with the ability to predict product reliability before a prototype is ever built. Sherlock users will now be able to use one tool to complete complex, 3D design and reliability analyses. This groundbreaking new feature is democratizing the process of electronics design by bringing powerful, analytical tools to everyday designers of electronics.

The current key trends in electronic technology – Internet of Things (IoT), Electrification, and Autonomous Transportation – share a focus in bringing power and intelligence closer to our everyday environment. But, this intelligence requires innovative electronic hardware that has never lived outside a datacenter, office, or home. And this hardware must operate at reliability levels far beyond what is currently expected for mobile phones or gaming consoles. How to solve this design reliability and safety challenge within the timeframe and price expectations of consumers? Simulation and modeling. Specifically, Reliability Physics Analysis or RPA which uses knowledge of failure mechanisms to predict reliability and improve product performance.

With the new Sherlock for SOLIDWORKS 3D CAD integrated software, mechanical and electronics designers and engineers can now quickly and easily predict the reliable lifetime of entire PCBAs (Printed Circuit Board Assemblies) under real world conditions, before a product is ever built.  Mechanical, electrical, or reliability engineers, even non-FEA experts, can now seamlessly import complex 3D objects into one tool and gain valuable insight into how mechanical structures, such as enclosures, batteries, thermal solutions, chassis, displays, and stiffeners influence and affect the robustness of electronics exposed to thermal and mechanical loads. This information is vital for simulating circuit card assemblies as close to reality as possible and improving overall product performance.

Topics: Reliability Physics, Sherlock, Sherlock Automated Design Analysis

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Realize Faster Time-to-Market through a Reliability Physics-Based Approach

Posted by DfR Solutions on Jul 11, 2018 9:00:00 AM

Beltsville, MD – July, 11, 2018 – DfR Solutions, pioneer in Reliability Physics and leader in quality, reliability, and durability solutions for the electronics industry, today announced that it will be giving two presentations at the Turbine Engine Technology Symposium (TETS) in Dayton, Ohio September 10-13, 2018. Dr. Craig Hillman, CEO, is presenting High Temperature Materials for Electronic Control Assemblies on Thursday, September 13 at 11:30 AM. Ed Dodd, VP of Business Development, is presenting Realize Faster Time-to-Market through a Reliability Physics-Based Approach on Wednesday, September 12 at 2 PM.

Topics: Reliability Physics, Aerospace

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DfR Solutions to Tackle Thermal Issues in Electronics at InterPACK

Posted by DfR Solutions on Jun 15, 2018 2:52:51 PM

Beltsville, MD – June 15, 2018 – DfR Solutions, pioneer in Reliability Physics and leader in quality, reliability, and durability solutions for the electronics industry, today announced that it would be presenting two sessions at InterPACK, Packaging and Integration of Electronic and Photonic MicrosystemsAugust 27 and 28 in San Francisco.  Dr. Vidyu Challa will present How to Qualify Your Batteries to Prevent Failures and Thermal Events on August 27 and participate in the Women in Engineering Panel on August 28. Maxim Serebreni will present the paper, Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects.

Topics: Reliability Physics

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DfR Solutions Discusses Board and Box Level Qualification

Posted by DfR Solutions on Jun 14, 2018 2:08:17 PM

Beltsville, MD – June 14, 2018 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that Ed Dodd, Vice President of Business Development, is speaking about Board Level Testing at the NASA Electronic Parts and Packaging Program. Mr. Dodd’s session takes place on 2:30 PM on Thursday, June 21. DfR Solutions is a pioneer in Reliability Physics analysis and works closely with the Aerospace industry to improve electronics reliability and safety.

Topics: Reliability Physics

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Autonomous Vehicle LIDAR Thermal Design and Field Durability Prediction Addressed

Posted by DfR Solutions on Jun 5, 2018 2:54:00 PM

Beltsville, MD – June 5, 2018 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that Dr. Craig Hillman, CEO of DfR Solutions will present Autonomous Vehicle LIDAR Thermal Design and Field Durability Prediction at the Integrated Electronics Solution Forum (IESF) Conference in Plymouth, MI on September 19th, 2018.

Topics: Reliability Physics, Autonomous Vehicles

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DfR Solutions to Present at Siemens PLM Connection

Posted by DfR Solutions on May 22, 2018 9:00:00 AM

Beltsville, MD – May 22, 2018 – DfR Solutions, the leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that it is presenting, Rapid and Accurate Reliability Analysis Through Nastran-Sherlock Integration, with Honeywell Aerospace at the Siemens PLM Connection - Americas June 4-7, 2018, in Phoenix, Arizona. Dr. Craig Hillman, CEO of DfR Solutions will be co-presenting with Randolph Hook, Staff Mechanical Engineer at Honeywell Aerospace on Wednesday, June 6 at 2:25 PM.

Topics: Reliability Physics

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DfR Solutions Addresses Mission Critical Impact on Electronics Reliability

Posted by DfR Solutions on May 14, 2018 9:08:00 AM

Beltsville, MD – May 14, 2018 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that Dr. Craig Hillman, CEO of DfR Solutions is speaking at the IPC High Reliability Forum for Mil-Aero and Automotive Sectors in Linthicum, Maryland, taking place May 15-17, 2018. Dr. Hillman will present System-Level Effects on Solder Joint Reliability on Thursday, May 17 at 10:45 AM. Dr. Hillman is a preeminent authority on electronics design reliability. DfR Solutions works closely with Aerospace and Automotive industries to improve electronics reliability and safety.

Topics: Reliability Physics, solder joint reliability

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DfR Solutions to Address Reliability Physics at IMAPS NORDPAC

Posted by DfR Solutions on May 1, 2018 7:00:00 AM

Beltsville, MD – May 1, 2018 – DfR Solutions, the leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that it is presenting, Overcoming Human Factors by Utilizing Design Modeling to Improve High Reliability Electronics at The Nordic Conference on Microelectronics Packaging, NordPac 2018, held June 12-14, 2018 in Oulu, Finland. Dr. Natalie Hernandez of DfR Solutions will present this paper as well as teach a short course called, Reliability Physics in the Early Design Phase.  This conference is a collaboration between IMAPS Nordic and IEEE EPS Nordic.

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DfR Solutions to Present on ISO-26262 at AEC Reliability Workshop

Posted by DfR Solutions on Apr 16, 2018 9:43:00 AM

Beltsville, MD – April 16, 2018 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that it is presenting, Initiatives for Addressing ISO-26262 Hardware Risk Assessments, at the 2018 Annual Automotive Electronics Council (AEC) Reliability Workshop on April 24 – 26 in Novi, Michigan. James McLeish and Ashok Alagappan, of the DfR Solutions Senior Technical Staff, will present with Senior Reliability/Test Engineer Keith M. Hodgson of Ford Motor Co. on Wednesday, April 25 from 4:00 PM to 5:30 PM.

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