THE ONLY CAD TO CAE SOLUTION DELIVERING RELIABILITY PHYSICS PREDICTIONS
Beltsville, MD – September 26, 2018 – DfR Solutions, pioneer in Reliability Physics Analysis and leader in quality, reliability, and durability solutions for the electronics industry, today announced a major new release of its Sherlock Automated Design Analysis™ software, version 6.0, Sherlock for SOLIDWORKS 3D CAD Integration. This significant new release includes integration with SOLIDWORKS 2018 that now empowers all SOLIDWORKS users with the ability to predict product reliability before a prototype is ever built. Sherlock users will now be able to use one tool to complete complex, 3D design and reliability analyses. This groundbreaking new feature is democratizing the process of electronics design by bringing powerful, analytical tools to everyday designers of electronics.
The current key trends in electronic technology – Internet of Things (IoT), Electrification, and Autonomous Transportation – share a focus in bringing power and intelligence closer to our everyday environment. But, this intelligence requires innovative electronic hardware that has never lived outside a datacenter, office, or home. And this hardware must operate at reliability levels far beyond what is currently expected for mobile phones or gaming consoles. How to solve this design reliability and safety challenge within the timeframe and price expectations of consumers? Simulation and modeling. Specifically, Reliability Physics Analysis or RPA which uses knowledge of failure mechanisms to predict reliability and improve product performance.
With the new Sherlock for SOLIDWORKS 3D CAD integrated software, mechanical and electronics designers and engineers can now quickly and easily predict the reliable lifetime of entire PCBAs (Printed Circuit Board Assemblies) under real world conditions, before a product is ever built. Mechanical, electrical, or reliability engineers, even non-FEA experts, can now seamlessly import complex 3D objects into one tool and gain valuable insight into how mechanical structures, such as enclosures, batteries, thermal solutions, chassis, displays, and stiffeners influence and affect the robustness of electronics exposed to thermal and mechanical loads. This information is vital for simulating circuit card assemblies as close to reality as possible and improving overall product performance.