DfR Solutions Reliability Designed and Delivered

DfR Solutions to Tackle Thermal Issues in Electronics at InterPACK

Posted by DfR Solutions on Jun 15, 2018 2:52:51 PM

Beltsville, MD – June 15, 2018 – DfR Solutions, pioneer in Reliability Physics and leader in quality, reliability, and durability solutions for the electronics industry, today announced that it would be presenting two sessions at InterPACK, Packaging and Integration of Electronic and Photonic Microsystems August 27 and 28 in San Francisco.  Dr. Vidyu Challa will present How to Qualify Your Batteries to Prevent Failures and Thermal Events on August 27 and participate in the Women in Engineering Panel on August 28. Maxim Serebreni will present the paper, Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects.

Topics: Reliability Physics

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DfR Solutions Discusses Board and Box Level Qualification

Posted by DfR Solutions on Jun 14, 2018 2:08:17 PM

Beltsville, MD – June 14, 2018 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that Ed Dodd, Vice President of Business Development, is speaking about Board Level Testing at the NASA Electronic Parts and Packaging Program. Mr. Dodd’s session takes place on 2:30 PM on Thursday, June 21. DfR Solutions is a pioneer in Reliability Physics analysis and works closely with the Aerospace industry to improve electronics reliability and safety.

Topics: Reliability Physics

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Autonomous Vehicle LIDAR Thermal Design and Field Durability Prediction Addressed

Posted by DfR Solutions on Jun 5, 2018 2:54:00 PM

Beltsville, MD – June 5, 2018 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that Dr. Craig Hillman, CEO of DfR Solutions will present Autonomous Vehicle LIDAR Thermal Design and Field Durability Prediction at the Integrated Electronics Solution Forum (IESF) Conference in Plymouth, MI on September 19th, 2018.

Topics: Reliability Physics, Autonomous Vehicles

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DfR Solutions to Present at Siemens PLM Connection

Posted by DfR Solutions on May 22, 2018 9:00:00 AM

Beltsville, MD – May 22, 2018 – DfR Solutions, the leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that it is presenting, Rapid and Accurate Reliability Analysis Through Nastran-Sherlock Integration, with Honeywell Aerospace at the Siemens PLM Connection - Americas June 4-7, 2018, in Phoenix, Arizona. Dr. Craig Hillman, CEO of DfR Solutions will be co-presenting with Randolph Hook, Staff Mechanical Engineer at Honeywell Aerospace on Wednesday, June 6 at 2:25 PM.

Topics: Reliability Physics

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DfR Solutions Addresses Mission Critical Impact on Electronics Reliability

Posted by DfR Solutions on May 14, 2018 9:08:00 AM

Beltsville, MD – May 14, 2018 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that Dr. Craig Hillman, CEO of DfR Solutions is speaking at the IPC High Reliability Forum for Mil-Aero and Automotive Sectors in Linthicum, Maryland, taking place May 15-17, 2018. Dr. Hillman will present System-Level Effects on Solder Joint Reliability on Thursday, May 17 at 10:45 AM. Dr. Hillman is a preeminent authority on electronics design reliability. DfR Solutions works closely with Aerospace and Automotive industries to improve electronics reliability and safety.

Topics: solder joint reliability, Reliability Physics

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DfR Solutions to Address Reliability Physics at IMAPS NORDPAC

Posted by DfR Solutions on May 1, 2018 7:00:00 AM

Beltsville, MD – May 1, 2018 – DfR Solutions, the leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that it is presenting, Overcoming Human Factors by Utilizing Design Modeling to Improve High Reliability Electronics at The Nordic Conference on Microelectronics Packaging, NordPac 2018, held June 12-14, 2018 in Oulu, Finland. Dr. Natalie Hernandez of DfR Solutions will present this paper as well as teach a short course called, Reliability Physics in the Early Design Phase.  This conference is a collaboration between IMAPS Nordic and IEEE EPS Nordic.

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DfR Solutions to Present on ISO-26262 at AEC Reliability Workshop

Posted by DfR Solutions on Apr 16, 2018 9:43:00 AM

Beltsville, MD – April 16, 2018 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that it is presenting, Initiatives for Addressing ISO-26262 Hardware Risk Assessments, at the 2018 Annual Automotive Electronics Council (AEC) Reliability Workshop on April 24 – 26 in Novi, Michigan. James McLeish and Ashok Alagappan, of the DfR Solutions Senior Technical Staff, will present with Senior Reliability/Test Engineer Keith M. Hodgson of Ford Motor Co. on Wednesday, April 25 from 4:00 PM to 5:30 PM.

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DfR Solutions Addresses Electronics Risks in Harsh Environments

Posted by DfR Solutions on Apr 12, 2018 9:24:00 AM

Beltsville, MD – April 12, 2018 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that Dr. Craig Hillman, CEO of DfR Solutions is speaking at the SMTA Europe Electronics in Harsh Environments Conference in Amsterdam, Netherlands. Dr. Hillman will present How to Design for Reliable Operation at 150C and Higher Temperatures: An Update at the Automotive Session on April 26, co-hosted by iNEMI. Dr. Hillman is one of three automotive electronics experts to be speaking on the panel.

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DfR Solutions and Electrolube Announce Joint Study Examining Cracking Defects of Conformal Coatings

Posted by DfR Solutions on Apr 10, 2018 2:11:00 PM

Beltsville, MD – April 10, 2018 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that it will be participating in a joint research study examining the cracking defects of conformal coatings with Electrolube, the established global manufacturer of specialist electro-chemicals.

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Announcing Award-Winning Temperature-Based FEA with Sherlock 5.4

Posted by DfR Solutions on Mar 27, 2018 1:46:51 PM

Beltsville, MD – March 27, 2018 – DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced the next release of Sherlock Automated Design Analysis™ software - Version 5.4.  Advanced features include Temperature-based FEA, Materials Library Expansion, Component Failure Modes, and a new Sqlite Parts Library option.  These expanded capabilities continue to empower Sherlock users to not only analyze their designs, but to make faster, more accurate reliability predictions.

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