Solder fatigue is the degradation of solder under cyclic loading. During temperature cycling, stresses are generated in the solder due to coefficients of thermal expansion (CTE) mismatches between the printed circuit board (PCB) and the components. Extensive work has been completed to characterize the behavior of various solder alloys and develop predictive solder fatigue damage models using Physics-of-Failure (PoF) approaches.
The solder joint fatigue calculators implement the Blattau model to predict the number of cycles to failure due to temperature cycling prescribed by the thermal profile defined. In the full Sherlock application, these calculations are completed for the entire PCB, within minutes. With the calculators presented online, we provide predictions based on individual components, allowing vital insight into Sherlock’s capabilities.
Ball Grid Arrays are surface mount packages used for integrated circuits (ICs). These high-density packages are particularly advantageous due their high number of interconnection pins. Using the Blattau approach, this calculator will compute the strain energy occurring in the corner and die shadow solder joints. Using the resulting information, it will predict the number of cycles to failure due to thermal cycling.
Ceramic chips are surface mount packages used most commonly for passive components. This calculator will assess the coefficient of thermal expansion (CTE) mismatch between the component and the board. With this information, it will predict the number of cycles to failure due to the prescribed thermal conditions.
QFP/SOIC/TSOP are surface mount packages with gullwing lead geometries extending from each of the four sides. These packages are used for integrated circuits (ICs). This calculator evaluates the solder joint fatigue due to the thermal profile provided, using the Blattau model. The result is a prediction of the number of cycles to failure for the specified component.
QFJ/SOJ/PLCC are surface mount packages with J-lead geometries extending from each of the four sides. They are used for integrated circuits (ICs). By using the supplied package geometries and materials, this calculator will provide the number of cycles to failure prediction due to solder fatigue induced by thermal cycling.
Radial/Axial packages are through-hole packages used for integrated circuits. Typically, holes are drilled through the PCB for mounting the components. This calculator computes the resulting mismatch in the coefficient of thermal expansion (CTE) between the component and the board. Subsequently, it calculates the number of cycles to failure due to the defined thermal stresses.
Ceramic Ball Grid Arrays are ceramic surface mount packages with an abundance of interconnection pins. This calculator executes the Blattau model which uses the packaging information, from die geometries to solder joint properties, to effectively predict the cycles to failure for this component due to the prescribed thermal events.
C-Lead packages are surface mount packages with ‘C’ shaped leads. These packages are usually implemented with tantalum capacitors and diodes. In this calculator, the Blattau model utilizes the given package geometries and materials to predict the number of cycles to failure induced by the defined thermal event.
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